1.75mm Bambu Lab PC - (1kg) (With Spool)

Product Features	Exceptional Thermal Resistance	Excellent Mechanical Properties	High Impact Strength and Durability	Suitable for Engineering Purpose	Comes with High Temperature Reusable Spool	Diameter: 1.75mm +/- 0.03mmCautions for Use	Dry out before use	AMS Compatible	Enclosure Printers Required Accessory Compatibility						 			Recommended			Not Recommended							Build Plate			Engineering Plate, High Temperature Plate or Textured PEI Plate			Cool Plate							Hotend			All Size / Material			/							Glue			Glue Stick			Bambu Liquid Glue			 RFID for Intelligent PrintingAll printing parameters are embedded in RFID, which can be read through our AMS (Automatic Material System).Load and print! No more tedious setting steps. Printing Tips:• Due to the transparent properties of the filament, Lidar Extrusion Calibration can be affected when printing Transparent PC.• Bambu PC needs proper drying before printing, recommended drying temperature is 80 ℃ for 8 hours in a blast drying oven, or 100 ℃ for 12 hours on a printer's heatbed.Download:	Filament TDS	Filament MSDS